It has been learned that recently, Boway Alloy, a leading domestic high-performance copper alloy materials company, disclosed on an investor interaction platform that its two new materials had achieved key progress in downstream certification and market development. Specifically, the special-shaped thermal material for the GB300 chip liquid cooling plate has passed the production line verification of two leading liquid cooling plate manufacturers, while the copper-aluminum composite material for low-voltage current carrying, developed jointly with TE Connectivity (TE), has also completed product certification and verification by several leading vehicle manufacturers. This dual breakthrough lays a solid foundation for the company to enter high-growth tracks.
In September 2025, the company revealed on the interaction platform that its VC thermal material has become a core component for a top-tier "Company A's" high-end models and will be fully utilized in the upcoming first-generation AI smartphone. As one of the leading copper alloy material companies in China—with three decades of expertise and participation in the formulation of national and industry standards—Bowy has achieved a breakthrough in high-performance thermal materials. This signifies a continuous increase in the share of domestic suppliers within the "Apple supply chain." Boway possesses systematic R&D and large-scale supply capabilities in细分 fields such as strips, rods/wires, and precision filaments. The core of a VC vapor chamber relies on high-conductivity copper-based materials, wick structures (sintering/mesh/grooves), and high-reliability packaging. The purity, thickness uniformity, surface quality, and formability of the materials directly determine thermal conductivity, isothermal capability, and yield rates. Boway's confirmed entry into "Company A's" VC supply chain means it has passed the quality and consistency thresholds set by top-tier clients regarding key substrates like copper-based strips and foils.
Currently, the power density of AI server chips and market demand are exploding simultaneously. Chips like the NVIDIA GB300 have become the core support for global AI computing infrastructure. Industry estimates suggest that global GB300 series chip shipments could exceed 1.5 million units in 2025 and climb further to over 3 million units in 2026, leading to exponential growth in the liquid cooling materials market. As a core computing chip, the GB300's single-chip power consumption has surpassed 600W, with some multi-chip cluster systems exceeding 3000W. Traditional air cooling is no longer sufficient, making liquid cooling the inevitable choice for commercialization. This places stringent demands on the thermal conductivity, structural strength, and machining precision of the materials.
To improve yield and reduce operational costs, the GB300 integrates the GPU, HBM memory, and related power modules into a single, independently detachable module. This means each GPU module has its own dedicated cold plate, rather than sharing a large one. This directly increases the number of cold plates and the complexity of the piping within the system. Furthermore, the slot-in design requires the cold plate assembly to have extremely high structural rigidity to maintain surface flatness after insertion and removal.
In the research and development of such cold plates, Boway Alloy leverages its advantages in copper-based special alloy formulations and processing technologies to manufacture materials that meet the requirements for micro-channel processing and stable operation. Compared to traditional copper materials, its alloys perform better in thermal conductivity efficiency, stress fatigue resistance, and corrosion resistance, thereby enhancing the stability and energy efficiency of liquid cooling plates in high-density computing servers. In the second half of 2025,
Bowayachieved another breakthrough in the AI server field. Its special-shaped thermal material, developed specifically for the GB300 chip, successfully passed the production line verification of two leading liquid cooling plate manufacturers, officially entering the core supply chain system of the GB300 chip.
It is understood that this material was developed specifically for the GB300's thermal demands. Leveraging the company's accumulated micro-alloying technology in copper alloys, Boway achieved a precise balance between thermal conductivity and structural strength. As a core component of liquid cooling systems, the deployment of this material will help data centers reduce cooling energy consumption. For reference, according to NVIDIA data, liquid cooling systems can save over $ 4 million annually for a 50-megawatt hyperscale data center. A responsible person from Boway Alloy stated that relying on its AI-driven material R&D platform, the company shortened the development cycle for this material by 80%, providing a technological guarantee for rapid market response. Liquid cooling is not just an innovation in chip cooling; it is an upgrade of the entire thermal management industry system.
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