CN
EMI-absorbing and heat-conductive material
Thermal Absorber Pad
The GXH-series thermally conductive EMI-absorbing pads combine efficient heat transfer, electromagnetic interference (EMI) absorption, and electromagnetic shielding in a single material. They also feature excellent dielectric strength and electrical insulation.
These pads achieve low interfacial thermal resistance even under relatively low compression pressure, effectively displacing air and ensuring optimal surface conformity between components. They can be directly applied between heat-generating components and metal enclosures or heat sinks, efficiently transferring heat away while simultaneously suppressing electromagnetic noise and providing EMI shielding—offering an integrated solution for thermal management and electromagnetic compatibility in electronic systems.
Key Features

High thermal conductivity with low thermal resistance

Outstanding dielectric strength and electrical insulation

Excellent electromagnetic wave attenuation (absorption + shielding)

Good surface compatibility with a wide range of substrates

High resilience and inherent tackiness (no additional adhesive required)

Market Applications
Components: PCBs, ICs, CPUs, MOSFETs, LED modules, power amplifiers
Devices: Laptops, routers, TVs, storage systems, power supplies and converters
Key Applications
Product Models
Item/Type1 mm Resonance PeakAttenuation Rate (dB/cm @ 18 GHz)Hardness (Shore OO)Density (g/cm³)Thermal Conductivity (W/m·K)Applicable Frequency Band
0.5mm1mm2mm
GXH-8230H758~10GHz95754.73KuXC
GXH-8740H7510~14GHz65754.44KXC
GXH-9115H7010~14GHz65704.01.5KXC
GXH-5020H658-12GHz75654.22KXC
GXH-8760H6510~14GHz60654.56KXC
GXH-AZ30H5012-16GHz45504.23KaKuC
GXH-8125H706~10GHz115705.02.5KuCS
GXH-8F40H6018~20GHz35604.04KaKX